In principle, the resin component should be carefully stirred at the beginning of processing. Resin compound can be prepared and processed under normal pressure even if an under vacuum preparation of resin and hardener if possible is widely suggested. Adherence to the mixing ratio and intensive mixing are thus important since otherwise variations in the mechanical and dielectric properties of the cured potting resin can occur. The potting method uses a “pot”, case or shell to put the device in and then pour the liquid potting compound to the top of the case covering the device and completely encasing it. The case becomes part of the finished unit. This is the most common method used, especially for high speed and many-units-per-hour production-line conditions.
The resin compound can be prepared and processed under normal pressure even if an under vacuum preparation of resin and hardener if possible is widely suggested.
Potting compounds can cure at room temperature or with the addition of heat if hot temperature hardeners are used.