Sealing
Depending on your individual requirements we offer different search and selection functions to help you find the appropriate material. The listed products are an extract from our actual product portfolio. More products are available on request.
Do you need further information about our adhesives for electronic applications? Please get in touch with us. We are looking forward to your email to bectron.elantas.europe@altana.com.
| Product | Curing | curing conditions | Temp. Range (°C) | Viscosity (Pas) | Tg (°C) | Density (g/cm³) | Description |
Bectron® SA 70L1-30 | Moisture cure | 24h @ RT (25°C/55% RH) | -55°C to +200°C | 44 | 1.05 | one-component system, medium viscosity, self leveling, translucent | |
| Bectron® SA 70P1-15 | Moisture cure | 24h @ RT (25°C/55% RH) | -55°C to +200°C | thixotropic paste | 1.03 | one-component system, thixotropic paste, translucent | |
| Bectron® SA 70P1-30 | Moisture cure | 24h @ RT (25°C/55% RH) | -55°C to +200°C | thixotropic paste | 1.08 | one-component system, thixotropic paste, translucent | |
| Bectron® SA 70P1-34 | Moisture cure | 24h @ RT (25°C/55% RH) | -55°C to +200°C | thixotropic paste | 1.50 | one-component system, thixotropic paste, white | |
| Bectron® SA 70P9-37 | Moisture cure | 24h @ RT (25°C/55% RH) | -55°C to +200°C | thixotropic paste | 1.50 | one-component system, thixotropic paste, black | |
| Bectron® SA 70P9-60 | Moisture cure | 24h @ RT (25°C/55% RH) | -55°C to +200°C | thixotropic paste | 1.25 | one-component system, thixotropic paste, black | |
Bectron® SA 70V1-36 | Moisture cure | 24h @ RT (25°C/55% RH) | -55°C to +200°C | 3.2 | 1.04 | one-component system, low viscous, self leveling, translucent |