Chemistry - Adhesives for Electronic applications
Depending on your individual requirements we offer different search and selection functions to help you find the appropriate material. The listed products are an extract from our actual product portfolio. More products are available on request.
Do you need further information about our adhesives for electronic applications? Please get in touch with us. We are looking forward to your email to bectron.elantas.europe@altana.com.
Acrylate
| Product | Curing | curing conditions | Temp. Range (°C) | Viscosity (Pas) | Tg (°C) | Density (g/cm³) | Description |
Elan-glue® | UV cure | 10s @ 65mW/cm2 | -20°C to | 0.4 | 45-70 | 1.08 | one-component system, low viscous, colourless, good adhesion on glass and metal, UV stable |
Elan- glue® | UV cure | 10s @ 65mW/cm2 | -20 °C to | 1.7 | 60-75 | 1.1 | one-component system, low viscous, colourless, good adhesion on non-polar plastic (like PE, PP, PS, PVC, etc.), glass and metal, UV stable |
| Elan-glue® AC 1650 | UV cure | 10s @ 65mW/cm2 | -20°C to | 14 | >150 | 1.05 | one-compoent system, thixotropic, colourless, good adhesion on polar plastic (like PC, PMMA, ABS, SAN, etc.), glass and metal, UV stable |
Epoxy
| Product | Curing | curing conditions | Temp. Range (°C) | Viscosity (Pas) | Tg (°C) | Density (g/cm³) | Description |
Elan- glue® | Thermal cure | 15 min @ 150°C or 15s @ 190°C | up to +150°C | 20 | 160 | 1.6 | one-component system, medium viscosity, ochre, chlorine < 5ppm |
| Elan-glue® EP 5340 | Thermal cure | 3h @ 120°C | 100 | 115 | 2.3 | one-component system, highly viscous, beige, thermal conductivity of 1 W/mK | |
| Elan-glue® EP 5350 | Thermal cure | > 80°C | -40°C to +150°C | 7.75 | 40-50 | 1.2 | one-component system, medium viscosity, thixotropic, beige, excellent adhesion on glass, metal, polar plastic |
| Elan-glue® EP 5610 | UV cure / thermal cure | 150mW/cm2 UVA @ 5s+ RT or 1h @ 150°C | up to +150°C | 1 | 125 | 1.2 | one-component system, low viscous, colourless/yellowish, good adhesion on metal/plastic/glass, low thermal expansion - CTE (<Tg) = 70ppm |
| Elan-glue® EP 5611 | UV cure / thermal cure | 50mW/cm2 UVA @ 3s + RT or 2 h @ 120°C | up to +150°C | 32.5 | 150 | 1.63 | one-component sytem, medium viscosity, thixotropic, brownish-grey, excellent adhesion on metal/plastic/glass, low thermal expansion - CTE (< Tg) = 41ppm |
| Elan-glue® EP 5620 | Thermal cure | 10min @ 130°C | up to +130°C | 0.8 (D=3s-1) | 1.15 | one-component system, low viscous, colourless, short temperature resistance up to 160°C |
Polyurethane
| Product | Curing | curing conditions | Temp. Range (°C) | Viscosity (Pas) | Tg (°C) | Density (g/cm³) | Description |
Bectron® | Moisture cure | 24h @ RT | -45°C to +105°C | 2.4 | 1.05 | one-component system, low viscous, colourless/transparent | |
| Bectron® AR 4820 N | Moisture cure | 24h @ RT | -45°C to +105°C | 7 | 0.99 | one-component system, low viscous, yellowish | |
| Bectron® AR 4822 N | Moisture cure | 24h @ RT | -45°C to +105°C | 15 | 0.98 | one-component system, medium viscosity, yellowish | |
| Bectron® AR 4824 N | Moisture cure | 24h @ RT | -50°C to +105°C | 16 | 1.1 | one-component system, medium viscosisty, yellowish, flexible fixing of capacitors | |
| Bectron® AR 4826 N | Moisture cure | 24h @ RT | -50°C to +105°C | thixothropic | 1.1 | one-component system, thixotropic, yellowish, flexible fixing of capacitors | |
| Bectron® AR 4828 N | Moisture cure | 24h @ RT | -50°C to +105°C | thixothropic | 1.1 | one-component system, thixotropic, yellowish, flexible fixing of capacitors |
Silicone
| Product | Curing | curing conditions | Temp. Range (°C) | Viscosity (Pas) | Tg (°C) | Density (g/cm³) | Description |
Bectron® | Moisture cure | 24h @ RT (25°C/55% RH) | -55°C to +200°C | 44 | 1.05 | one-component system, medium viscosity, self leveling, translucent | |
| Bectron® SA 70P1-15 | Moisture cure | 24h @ RT (25°C/55% RH) | -55°C to +200°C | thixotropic paste | 1.03 | one-component system, thixotropic paste, translucent | |
| Bectron® SA 70P1-30 | Moisture cure | 24h @ RT (25°C/55% RH) | -55°C to +200°C | thixotropic paste | 1.08 | one-component system, thixotropic paste, translucent | |
| Bectron® SA 70P1-34 | Moisture cure | 24h @ RT (25°C/55% RH) | -55°C to +200°C | thixotropic paste | 1.50 | one-component system, thixotropic paste, white | |
| Bectron® SA 70P9-37 | Moisture cure | 24h @ RT (25°C/55% RH) | -55°C to +200°C | thixotropic paste | 1.50 | one-component system, thixotropic paste, black | |
| Bectron® SA 70P9-60 | Moisture cure | 24h @ RT (25°C/55% RH) | -55°C to +200°C | thixotropic paste | 1.25 | one-component system, thixotropic paste, black | |
Bectron® | Moisture cure | 24h @ RT (25°C/55% RH) | -55°C to +200°C | 3.2 | 1.04 | one-component system, low viscous, self leveling, translucent | |
| Bectron® SA 75L7-70 | Thermal cure | 24min @ 100°C | -50°C to +250°C | 50 | 1.90 | one-component system, medium visvosity, thermal conductivity of 1.4W/(m*K), grey |